DSpace Repository

The Chemistry and Fracture Testing of Durable Low-Temperature-Curing Adhesives

The Chemistry and Fracture Testing of Durable Low-Temperature-Curing Adhesives

Arah, C.;Vogin, J.;McNamara, D.;Ahearn, J.;Desai, A.;Fitz, T.;Hand, H.;Mecklenburg, Marion F.
Date: 1987

Citation:

Arah, C., Vogin, J., McNamara, D., Ahearn, J., Desai, A., Fitz, T., Hand, H., and Mecklenburg, Marion F. 1987. [Poster] The Chemistry and Fracture Testing of Durable Low-Temperature-Curing Adhesives. https://repository.si.edu/handle/10088/55636.

Show full item record

Files in this item

Thumbnail
Name: Arah et al. - 1987 ...
Size: 3.946Mb
Format: PDF
Description: reprint PDF
View/Open

This item appears in the following Collection(s)

Search DSpace


Browse

My Account