The Chemistry and Fracture Testing of Durable Low-Temperature-Curing Adhesives

Arah, C.; Vogin, J.; McNamara, D.; Ahearn, J.; Desai, A.; Fitz, T.; Hand, H.; Mecklenburg, Marion F.

dc.contributor.author	Arah, C.	en
dc.contributor.author	Vogin, J.	en
dc.contributor.author	McNamara, D.	en
dc.contributor.author	Ahearn, J.	en
dc.contributor.author	Desai, A.	en
dc.contributor.author	Fitz, T.	en
dc.contributor.author	Hand, H.	en
dc.contributor.author	Mecklenburg, Marion F.	en
dc.date.accessioned	2018-08-31T18:13:05Z
dc.date.available	2018-08-31T18:13:05Z
dc.date.issued	1987
dc.identifier.citation	Arah, C., Vogin, J., McNamara, D., Ahearn, J., Desai, A., Fitz, T., Hand, H., and Mecklenburg, Marion F. 1987. [Poster] The Chemistry and Fracture Testing of Durable Low-Temperature-Curing Adhesives. <a href="https://repository.si.edu/handle/10088/55636">https://repository.si.edu/handle/10088/55636</a>.	en
dc.identifier.uri	https://hdl.handle.net/10088/55636
dc.title	The Chemistry and Fracture Testing of Durable Low-Temperature-Curing Adhesives	en
dc.type	Poster	en
dc.identifier.srbnumber	147686
dc.description.SIUnit	MCI	en
dc.description.SIUnit	Poster	en