The Chemistry and Fracture Testing of Durable Low-Temperature-Curing Adhesives

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dc.contributor.authorArah, C.
dc.contributor.authorVogin, J.
dc.contributor.authorMcNamara, D.
dc.contributor.authorAhearn, J.
dc.contributor.authorDesai, A.
dc.contributor.authorFitz, T.
dc.contributor.authorHand, H.
dc.contributor.authorMecklenburg, Marion F.
dc.date.accessioned2018-08-31T18:13:05Z
dc.date.available2018-08-31T18:13:05Z
dc.date.issued1987
dc.identifier.citationArah, C., Vogin, J., McNamara, D., Ahearn, J., Desai, A., Fitz, T., Hand, H., and Mecklenburg, Marion F. 1987. [Poster] <em><a href="https://repository.si.edu/handle/10088/55636">The Chemistry and Fracture Testing of Durable Low-Temperature-Curing Adhesives</a></em>.
dc.identifier.urihttps://hdl.handle.net/10088/55636
dc.titleThe Chemistry and Fracture Testing of Durable Low-Temperature-Curing Adhesives
dc.typeposter
sro.description.unitMCI
sro.description.unitPoster
sro.identifier.itemID147686
sro.identifier.refworksID2832
sro.identifier.urlhttps://repository.si.edu/handle/10088/55636

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